Precision grooving for semiconductor lead frames, JP/TW technology heritage
Lead frames demand extreme grooving precision and surface quality. Inheriting Japanese and Taiwanese advanced technology, this machine features a high-rigidity bed and high-resolution servo system for smooth cutting force and micron-level feed control. It reliably grooves precise slots in thin copper-alloy strip with consistent width and depth and minimal burr, delivering sound substrates for plating and packaging — ideal for IC and discrete device lead frame mass production.
| Workpiece | Lead frame copper alloy strip |
|---|---|
| Technology | JP/TW technology heritage |
| Spindle Config | Single 2-axis ~ Double 11-axis |
| Feed Control | High-res servo, micron-level |
| Burr Control | Minimal burr for plating/packaging |
| Inspection | Real-time |
Common lead frame copper alloy strip (0.1-0.6mm class) is supported; adapt via parameters and tooling per your process.
High-rigidity bed and high-resolution servos keep grooving stable; tooling management and fixed parameters ensure batch consistency; real-time inspection monitors drift.
1) Send workpiece drawings/samples and process requirements. 2) We evaluate and propose machine configuration and quote. 3) Production starts after confirmation, with progress updates. 4) Test-run and acceptance before shipment. 5) Delivery, installation and training. One-on-one support throughout.
